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SMTS Analog Design Engineer, Mixed-Signal PHY; Clocking Speed I​/O

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology
Full Time position
Listed on 2026-06-01
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Electrical Engineering, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 159000 - 347000 USD Yearly USD 159000.00 347000.00 YEAR
Job Description & How to Apply Below
Position: SMTS Analog Design Engineer, Mixed-Signal PHY (Clocking & High-Speed I/O)

Overview

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron's Interface Pathfinding team operates at the leading edge of that mission — driving performance‑scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As a Principal Analog Design Engineer, you will be a core technical contributor on a small, senior team spanning analog design, layout, silicon characterization, digital design, and physical design — united around the goal of preparing high‑speed interface innovations for high‑confidence product adoption.

Responsibilities
  • Own the design of one or more custom analog blocks from specification through schematic, simulation, and layout review — with clocking (PLL, DLL, CDR) as the primary focus and transmitter/receiver circuits as valued secondary experience.
  • Contribute to top‑level PHY analog architecture decisions — clocking topology, signal chain partitioning, power domain strategy, and performance/area/power tradeoffs.
  • Develop and maintain transistor‑level simulation test benches; execute corner, Monte Carlo, and mismatch analysis to characterize design margin and yield sensitivity.
  • Define clean interface specifications between custom analog blocks and the digital control wrapper — signal naming, timing contracts, and boundary constraint documentation in coordination with the Chip Lead.
  • Work closely with the layout team to review and guide custom analog layout — matching, shielding, guard ring, and parasitic sensitivity for high‑speed circuits.
  • Support post‑silicon characterization in the lab — correlating measured results to simulation, identifying root causes of performance delta, and extracting maximum learning from each hardware run.
  • Author block‑level specifications, simulation summary reports, and interface control documents that serve as the authoritative reference for the team and for follow‑on program development.
Basic Qualifications
  • BS, MS, or PhD in Electrical Engineering or related field (MS/PhD strongly preferred for this level).
  • 10+ years of analog/mixed‑signal IC design experience with at least one tape‑out in a primary circuit ownership role.
  • Deep expertise in clocking circuit design — PLL, DLL, or CDR architecture and transistor‑level implementation in advanced CMOS nodes.
  • Strong transistor‑level simulation skills using HSpice or equivalent; comfort with corner, Monte Carlo, and mismatch analysis for yield‑aware design.
  • Solid understanding of jitter analysis — phase noise, period jitter, cycle‑to‑cycle jitter, and their impact on high‑speed link timing margins.
  • Experience defining analog‑digital interfaces in a mixed‑signal environment — including timing contracts, reset/initialization sequencing, and digital control of analog parameters.
  • Ability to work effectively as a peer technical contributor on a small team — comfortable with broad ownership, cross‑discipline collaboration, and making design decisions with real consequences.
  • Strong written communication skills — this role produces specifications and simulation reports, not just schematics.
Preferred Qualifications
  • Experience with high‑speed transmitter design — output driver architectures, pre‑emphasis, swing control, and impedance matching for multi‑Gbps die‑to‑die or Ser Des interfaces.
  • Experience with high‑speed receiver design — sense amplifiers, CTLE/DFE equalization, sampler design, and threshold calibration.
  • Familiarity with die‑to‑die or chip‑to‑chip PHY architectures — UCIe, AIB, BoW, or proprietary short‑reach interconnect standards.
  • Experience with OTP/fuse‑based calibration architectures and analog trim loop implementation.
  • Familiarity with real‑number modeling (RNM) or Verilog‑AMS behavioral modeling for use in mixed‑signal simulation environments.
  • Post‑silicon characterization experience — correlating simulation results to measured eye diagrams, BER curves, phase noise plots, and jitter histograms on real…
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