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Principal Engineer - Advanced Packaging Innovation

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-01
Job specializations:
  • Engineering
    Packaging Engineer, Product Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 140000 USD Yearly USD 100000.00 140000.00 YEAR
Job Description & How to Apply Below

Micron Technology, Inc in Boise is looking for a Principal Engineer in Advanced Package Technology Development. In this role, you will lead innovation efforts through strategic leadership, influencing the development of packaging technologies and ensuring alignment with business objectives.

Applicants should possess over 5 years of experience in semiconductor advanced packaging and a relevant degree. The position offers a dynamic environment focused on driving technological advancements and business value.

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