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Principal Engineer, Advanced Packaging Innovation
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-06-01
Listing for:
1000 Micron Technology, Inc.
Full Time
position Listed on 2026-06-01
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer, Product Engineer
Job Description & How to Apply Below
1000 Micron Technology, Inc. is seeking a Principal Engineer to innovate within the Advanced Package Technology Development team in Boise. This role involves shaping packaging technology roadmaps and driving strategic technical leadership while collaborating with partners to deliver differentiated solutions.
The ideal candidate has over 5 years of experience in semiconductor advanced packaging and a relevant degree. Micron offers flexible healthcare plans, paid family leave, and a robust paid time-off program, supporting your well-being and work-life balance.
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