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Engineer - Metals Adv DRAM

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-02
Job specializations:
  • Engineering
    Process Engineer, Electrical Engineering, Electronics Engineer, Materials Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Engineer - Metals Advanced DRAM

Develop new or modified process formulations, define processing or handling equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Coordinate design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compile and evaluate test data to determine appropriate limits and variables for process or material specifications. Conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

Work directly with process integration and other process areas such as Dry Etch, Wet Etch, CVD, Diffusion, Lithography & CMP. Work on state of the art and best‑in‑class metals chambers and own the process roadmap to meet program and yield goals. Understand solid‑state physics including transition metal oxides, metals, surfaces, and interfaces. Understand fundamental challenges in materials exploration for device scaling.

Understand chemical kinetics and their direct application to CVD, ALD, and PVD deposition processes in various deposition reactors.

Qualifications

Education:

Master’s degree in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or related field and 3 years of experience in the job offered or in a related occupation. Alternatively, PhD in a relevant field is acceptable.

  • Working with thin film deposition equipment in lab or clean‑room environment.
  • Experience with deposition processes (PVD, CVD or other techniques) and film characterization.
  • Thin film analysis and surface analysis techniques: SIMS, XPS, EDS, AFM, SEM, or other crystallographic techniques.
  • Knowledge of materials physics, including principles governing the structure, properties and electronic structure of advanced materials.
  • Understanding of material growth mechanisms: thin film deposition, crystallization and interfaces.
  • Electrical and physical analysis of semiconductor devices or nanostructures, device physics, and principles of electronic circuit design.
  • Scientific programming and scripting for data analysis and automation (Python, MATLAB, or JMP).
EEO Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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