Product Development Engineer

Responsibilities

• Conduct Physical Defect Analysis.
• Find and analyze physical defects.
• Relate electrical failure modes to physical defects.
• Utilize layout to correlate failures when necessary.
• Perform layer by layer de-processing using wet and dry etch.
• Operate the Focused Ion Beam (FIB) and Scanning Electron Microscope (SEM).
• Perform fault isolation through voltage contrasting (PVC).
• Prepare Scanning Transmission Electron Microscope (STEM) and Transmission Electron Microscope (TEM) samples.
• Submit TEM requests for full analytic work.
• Save images and write detailed reports.
• Consult with customers.
• Create DRAM Physical Failure Analysis (PFA) and procedural reference documents.
• May telecommute part-time.

• Bachelor's degree in Engineering or related field.
• Experience with Focused Ion Beam (FIB) and Scanning Electron Microscope (SEM).
• Experience preparing lamella (very thin sample) for STEM and TEM analysis.
• Experience de-layering samples using mechanical polish, chemical and dry etch.
• Knowledge of chemical safety procedures.
• Experience with CAD (computer-aided design) layout.
• Experience using statistical tools for detailed data analysis to drive yield improvement projects.

Micron offers medical, dental and vision plans, robust paid time‑off, paid holidays, income protection benefits, paid family leave and a variety of other benefits designed to support well‑being and professional growth.

Micron is a proud equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.