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Lead Die Bonding Process Engineer – Yield & Innovation

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-02
Job specializations:
  • Engineering
    Manufacturing Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below

Micron Technology, Inc is seeking a Principal Process Engineer to enhance die bonding processes and improve product quality and reliability. This role focuses on optimizing production methods and resolving manufacturing issues while collaborating with suppliers and conducting internal audits.

The ideal candidate will have at least 8 years of semiconductor experience, a BS degree in a relevant field, and strong communication skills. Benefits include medical, dental, and vision plans as well as generous paid time off.

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