Senior Engineer, Field Process; Boise

Position: Senior Engineer, Field Process (Boise, ID)
Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.

Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Senior Field Process Engineer (FPE)

Location:

Boise, Idaho

Role Overview

The Senior Field Process Engineer (FPE) is responsible for on‑site process development in close collaboration with customer R&D, technology development organizations, and business units. This role owns and drives joint process development and qualification of new ASM systems and products, while fostering strong customer relationships and interfacing with global business unit teams.

Key Responsibilities

New Product Introduction (NPI)

* Lead joint process development and qualification of new ASM systems and products at customer sites.

* Receive training from ASM Business Units to gain expertise in newly developed deposition processes (PEALD, PECVD, Epitaxy, LPCVD/vertical furnace) and hardware.

* Manage the introduction and transfer of new processes and hardware to customer sites.

* Collaborate closely with field hardware, service, sales teams, and Business Units to support and troubleshoot new product issues.

* Develop proposals for equipment and process design improvements and conduct experiments with customers.

* Escalate issues as needed to ensure timely resolution and adherence to project scope and timelines.

* Document NPI learnings to support future IQ, hardware, and process rollout packages.

* Facilitate knowledge transfer to local process and service teams at manufacturing sites.

* Provide in‑depth process and equipment expertise, troubleshooting leadership, and escalation support to ensure successful NPI implementation.

On‑Site Process Development

* Support customer deposition process and hardware development, including new development and continuous improvement projects (CIP).

* Work closely with customers to design and execute experiments for device integration, process development, troubleshooting, and CIP needs.

* Analyze baseline process and system performance and identify gaps relative to technology node requirements.

* Perform problem assessment and root cause analysis of system performance non‑conformances at customer sites.

* Identify and develop new opportunities for ASM process and hardware introductions at customer sites.

High‑Volume Manufacturing (HVM) Process Transfer

* Lead process transfer to HVM fabs and transfer product knowledge to local field process and service organizations.

* Document process and hardware learnings from development phases and develop Best Known Methods (BKMs).

* Ensure effective transfer of BKMs to HVM site teams.

Education

* PhD preferred;
Master's or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related discipline.

Experience & Skills Requirements

* Equivalent combination of education and experience with strong fundamentals in thin‑film processing, development, and characterization using deposition reactors such as thermal ALD, PEALD, PECVD, and Epitaxy.

* Minimum of 3-5 years of experience as a process engineer, or a combination of relevant academic and industry experience.

* Experience with DRAM and NAND device integration and technology development preferred.

* Experience with advanced packaging integration and process development (wafer‑level hybrid bonding, fusion bonding, die‑to‑wafer, HBM) preferred.

* Strong knowledge of semiconductor device applications (DRAM and NAND), vacuum techniques, film characterization and metrology, and ALD deposition equipment.

* Demonstrated success in film deposition optimization and process development;…