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Head of Advanced Packaging Materials & Integration

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: 1000 Micron Technology, Inc.
Full Time position
Listed on 2026-06-03
Job specializations:
  • Engineering
    Materials Engineer
Salary/Wage Range or Industry Benchmark: 150000 - 200000 USD Yearly USD 150000.00 200000.00 YEAR
Job Description & How to Apply Below

1000 Micron Technology, Inc. is looking for a Director of Package Materials Integration in Boise, Idaho. This role will lead and execute the strategy for Micron's advanced packaging materials for 3D memory products. The successful candidate will manage a global team, ensuring alignment across development programs and collaborating with cross-functional partners.

The ideal candidate would possess a strong technical background with over 15 years in semiconductor manufacturing, proven leadership in packaging technology, and excellent communication skills to guide diverse teams effectively.

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