DMTS, Systems Architect

Overview

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The DRAM Architecture team is responsible for defining the system‑level and silicon‑level architectures that enable Micron’s memory products. The team works across technology generations and product lines, collaborating with design, product, systems, and ecosystem partners to deliver scalable, reliable, and high‑performance memory solutions aligned with customer and market needs.

This role provides senior‑level architectural leadership to help shape Micron’s next‑generation DRAM products. As a Distinguished Member of Technical Staff, you will influence memory architecture decisions across semiconductor chips, assembly methods, component units, and system interfaces, contributing to both near‑term product execution and long‑term technology direction.

• Define and evolve DRAM system architectures that address performance, capacity scaling, reliability (RAS), and observability requirements.
• Collaborate across functions to evaluate architectural trade‑offs spanning DRAM silicon, packaging, modules, boards, and system platforms.
• Influence host memory controller and platform architecture through technical engagement with CPU, GPU, and SoC partners.
• Contribute to RAS and telemetry feature definition, translating system‑level needs into implementable architectural concepts.
• Support exploration of emerging memory technologies and assess their impact on future product roadmaps.
• Engage with customers, product teams, and business partners to communicate architectural direction and support informed design decisions.
• Serve as a technical mentor and steward, supporting architectural consistency and collaboration across teams.

• Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
• Extensive professional experience working with DRAM architecture, memory systems, or advanced semiconductor builds.
• Demonstrated experience translating system or customer requirements into architectural or silicon‑level solutions.
• Experience collaborating across multiple technical domains (e.g., silicon, packaging, systems, or platforms).

• Advanced degree (MS or PhD or equivalent experience) in a relevant engineering or computer science field.
• Experience defining or influencing RAS, reliability, or telemetry features in production or pre‑production designs.
• Experience engaging directly with customers, ecosystem partners, or industry standards organizations (such as JEDEC).
• Demonstrated technical leadership across multiple projects or product generations.
• Familiarity with system‑level trade‑offs related to performance, power, signal integrity, thermals, or cost.

The US base salary range for this full‑time position is $ - $ per year. Additional compensation may include benefits, bonuses and equity. Salary ranges are determined by role, level, and location, and can vary by location and other factors. The recruiter can share the specific salary range for a preferred location during the hiring process. Compensation details reflect base salary and do not include bonuses, equity, or benefits.

Micron is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable laws.

To learn more about Micron, please visit  For U.S. site assistance with the application process or reasonable accommodations, contact Micron’s People Organization at  or