HBM SoC Physical Design Engineer — Lead Tape PPA
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-06-04
Listing for:
Micron Technology, Inc
Full Time
position Listed on 2026-06-04
Job specializations:
-
Engineering
Job Description & How to Apply Below
A leading semiconductor company is hiring an HBM SoC Physical Design Engineer in Boise, Idaho. The role entails driving implementation from netlist to GDSII, focusing on physical optimization and timing closure. Ideal candidates will have strong experience in SoC design, familiarity with EDA tools, and a solid understanding of physical verification processes. This full-time position offers a salary range of $146,000 to $309,000, plus benefits and opportunities for professional growth.
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