Principal Engineer Advanced Technology Development Boise, Idaho, of Ameri

Position: Principal Engineer Advanced Package Technology Development Boise, Idaho, United States of Ameri[...]
## Principal Engineer Advanced Package Technology Development Boise, Idaho, United States of America
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
* Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
* Collaborate continuously with internal and external partners to ensure seamless technology integration.
* Consult and influence technical and strategic decisions at senior management levels.
* Analyze and understand competitive trends to improve Micron’s competitive edge.
* Guide the development of packaging technology roadmaps.
* Assess competitive metrics through data intelligence for strategic advantage.
* Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.
* Understanding of DRAM wafer structure and process flows (Highly Preferred).
* A passion for innovation demonstrated by patent inventions or published literature!

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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** Job summary
** As a Principal Engineer in the Advanced Package Technology Development team at Micron, you will join a dynamic group focused on innovation and collaboration. This role lets you influence solutions that align with company goals. It contributes to increased revenue and strategic successes. You will work at our Boise campus and help develop leading technology in the industry.
** Responsibilities
* * Define requirements with proven technical data and content..
** Minimum Qualifications
** Over 5 years of professional experience in semiconductor advanced packaging. BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience. Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required). Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required). Experience in DRAM manufacturing and OSAT companies (Required).

** Preferred Qualifications
** Proficient in English, with additional language skills in East Asian languages being highly preferred. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. …