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Die Bonding Process Engineering Lead

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-06
Job specializations:
  • Engineering
    Quality Engineering, Systems Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below
Micron Technology, Inc in Boise, Idaho is looking for a Principal Process Engineer to lead die bonding technology advancements. The ideal candidate should have a BS degree combined with at least 8 years of experience in semiconductor process engineering. Responsibilities include developing and optimizing processes, validating new technologies, and managing supplier relationships. Micron offers comprehensive benefits, including medical, paid leave, and a robust paid time-off program.
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