Process Integration Engineer | APTD Boise, Idaho, Posted ago

Position: Process Integration Engineer | APTD Boise, Idaho, United States of America Posted 20 hours ago
## Process Integration Engineer | APTDBoise, Idaho, United States of America
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
** Department Intro:
** The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. This team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

Join this forward-thinking team that is molding the future of technology!
*
* Position Overview:

** As a Process Integration Engineer within APTD your responsibilities include but are not limited to developing and enabling deployment of advanced interconnect technologies. Successful development and deployment will ensure that products which use the developed technologies meet performance, cost, manufacturability, quality, reliability and schedule requirements. Also, you will have responsibility to work with peers and internal partners across organizations to coordinate the development and launch of new technologies and integration flows.
** Responsibilities:
*** This role is open to candidates at
** Process Engineer Levels 2, 3, or 4**.
* Work with peers, internal teams and external suppliers to develop new technology / capabilities required for innovative packaging solutions.
* Provide innovative and efficient advanced packaging solutions on time and with best predictable reliability performance.
* Work with peers to establish project timelines and verification of work needed to validate new technology.
* Ensure smooth transition from new product development, qualification, small volume production to high volume production
* Understand future trends, technology and capabilities required for future advanced packaging solutions
* Work with peers and internal teams to define future roadmaps
* Continually grow your own technical and management skills and pursue continued education.
* Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.
* Maintain area procedures and training required to ensure legal compliance and conformance to management system
* Support Internal and External Audits
*
* Required Experience:

*** 3+ years of professional experience in the semiconductor industry.
* MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior‐level technical capability.
* Professional experience in process integration, process development, advanced packaging, or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).
** Additional Qualifications (Preferred)
*** We recognize that highly qualified candidates may not meet every qualification listed below. Candidates whose experience aligns with most of these qualifications and who bring strong process integration and technical development leadership are encouraged to apply.
** End‐to‐end ownership of integration solutions, including technology definition, process development, qualification, and successful transfer to high‐volume manufacturing.
* Deep, practical expertise in advanced packaging and interconnect technologies, such as:
* 2.5D and 3

DIC integration
* Wafer‐level and fan‐out packaging
* Wirebond, microbump, and/or hybrid bonding
* Semiconductor technology background, with experience in memory (DRAM, NAND) and/or logic
* Demonstrated strength in process integration problem‐solving, including:
* Design of Experiments (DoE) and data-driven decision making
* Root‐cause analysis and…