Sr BEOL Engineer - DRAM Process Integration

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative designs are pushing the boundaries of what's possible in the future of semiconductors.

We are seeking a motivated Process Integration Engineer to join our BEOL (Back‑End‑Of‑Line) team within DRAM Research & Development. This role is ideal for recent graduates or early‑career engineers who are eager to develop deep expertise in semiconductor process integration, metallization, and interconnect technologies. You will work alongside experienced integration engineers to develop, optimize, and transfer advanced DRAM BEOL process flows.

Strong fundamentals in materials science, electrical engineering, or a related discipline are essential. Prior semiconductor experience is valued but not required – we invest in developing our engineers.

• Support BEOL process flow development, optimization, and integration for advanced DRAM technologies.
• Assist in troubleshooting integration issues across multiple process modules (metallization, dielectrics, etch, CMP).
• Collect, analyze, and interpret process and electrical data to drive yield improvement and reliability enhancement.
• Collaborate with cross‑functional teams (module engineers, device engineers, reliability, manufacturing) to resolve technical challenges.
• Participate in technology transfer activities from R&D to pilot production.
• Document findings and present results to peers and leadership.
• Learn and apply statistical analysis tools and methodologies (JMP, Python, R, or equivalent).
• Support pathfinding efforts for next‑generation BEOL architectures and materials.

• MS/PhD (preferred)/BS (required) in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or related field with coursework or research in thin films, interconnect technology, or nanofabrication.
• Foundational understanding of semiconductor fabrication processes (thin film deposition, etch, lithography, CMP).
• Familiarity with BEOL concepts: metallization, interconnects, dielectrics, barrier/liner films.
• Hands‑on experience with deposition techniques (CVD, ALD, PVD) or etch processes.
• Exposure to DRAM or memory device technology paired with experience with process integration, yield improvement, or reliability testing.

• Internship or co‑op experience in a semiconductor fab or R&D environment.
• Willingness to learn, adapt, and work in a fast‑paced R&D environment.
• Proficiency in statistical analysis tools (JMP, Python, R, etc.).
• Familiarity with characterization techniques: SEM, TEM, XRD, electrical testing.
• Experience with Design of Experiments methodology.
• Knowledge of semiconductor reliability concepts (electromigration, TDDB, stress migration).

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations, benefit programs that help protect your income if you are unable to work due to illness or injury, paid family leave, robust paid time‑off program and paid holidays.

For additional information regarding our benefit programs, please see the benefits guide posted on

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.