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Wafer Bonding Process Engineer: Advanced Development

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-06-21
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Chemical Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Micron Technology, Inc in Boise, Idaho is seeking experienced Process Engineers to develop process technology for wafer bonding. Candidates should have a strong background in materials or chemical engineering and hands-on experience with wafer bonding.

The role involves process ownership, collaborating with multifunctional teams, and optimizing processes to align with DRAM roadmap requirements. Micron offers competitive benefits and values diversity in the workplace.

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