Process Integration Engineer | APTD

Position Overview

As a Process Integration Engineer within APTD your responsibilities include but are not limited to developing and enabling deployment of advanced interconnect technologies. Successful development and deployment will ensure that products which use the developed technologies meet performance, cost, manufacturability, quality, reliability and schedule requirements. Also, you will have responsibility to work with peers and internal partners across organizations to coordinate the development and launch of new technologies and integration flows.

This role is open to candidates at Process Engineer Levels 4, 5 or MTS.

• Collaborate with peers, internal teams, and external suppliers to develop innovative advanced packaging technologies.
• Deliver reliable, efficient packaging solutions on schedule with predictable performance.
• Define project timelines and validation plans to qualify new technologies.
• Enable smooth transitions from development and qualification through low‑ and high‑volume production.
• Anticipate future trends and define technology roadmaps for advanced packaging solutions.
• Continuously develop technical and leadership skills through ongoing learning.
• Promote and enforce a culture of safety, compliance, and ethical behavior.
• Maintain procedures, training, and audit readiness to ensure regulatory and management system compliance.

• 3+ years of professional experience in the semiconductor industry.
• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior-level technical capability.
• Professional experience in process integration, process development, advanced packaging, or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).

• End-to-end ownership of integration solutions, from technology definition and process development through qualification and high-volume manufacturing transfer.
• Deep, hands‑on expertise in advanced packaging and interconnect technologies, including 2.5D/3
  
  DIC integration, wafer‑level and fan‑out packaging.
• Practical experience with interconnect methods such as wirebond, microbump, and/or hybrid bonding.
• Strong semiconductor technology background with experience in memory (DRAM, NAND) and/or logic devices.
• Proven strength in process integration problem‑solving using DoE, data-driven decision making, and root-cause analysis.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations, benefit programs that help protect your income if you are unable to work due to illness or injury, paid family leave, a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.