Principal Process Engineer, Die Bonding

Principal Process Engineer In Die Bonding

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities:

• Develop, diagnose, and resolve various die bonding process technologies
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
• Lead and participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
• Support SPC/FDC/RMS/APC and site-to-site portability
• Support internal and external audits

Minimum Qualifications:

• A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes
• Skilled at designing valid tests and Design of Experiments (DOE)
• Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
• Excellent oral and written communication skills and a strong attention to detail
• Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
• Knowledge and an understanding of project management

Preferred Qualifications:

• Masters or Doctorate degree in Engineering, Physics, or related field
• Experience in working on Die Bonding:
  Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
• Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.