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EUV Mask Technology FEOL RND Engineer

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-07-14
Job specializations:
  • Engineering
    Materials Engineering, Process Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 190000 USD Yearly USD 120000.00 190000.00 YEAR
Job Description & How to Apply Below

Req  EUV Mask Technology FEOL RND Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron’s Mask Technology Center (MTC), we develop the materials, films, and processes that enable next‑generation AI assisted EUV lithography. Our team collaborates across materials science, lithography, OPC, and high‑volume manufacturing to solve critical challenges in advanced DRAM scaling. We are a hands‑on, innovative group driving technologies that shape the future of High‑NA EUV.

In this role, you will join an R&D team focused on next‑generation EUV mask materials and processes, helping drive readiness for High‑NA EUV manufacturing. You will contribute to technology roadmap development, partner with world‑class engineering teams and suppliers, and translate complex lithography requirements into robust, manufacturable mask solutions.

Responsibilities
  • Develop AI assisted EUV mask blank materials and processes, including film stack design, deposition, etch, clean, and patterning quality
  • Advance High‑NA EUV readiness through material selection, mask design, stitching, lithography performance optimization, and lifetime improvement
  • Translate lithography requirements into manufacturable mask solutions in collaboration with OPC, design, and lithography teams
  • Conduct data‑driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability
  • Collaborate with cross‑functional engineering teams to transition new technologies into FEOL process engineering
Minimum Qualifications
  • MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or a related field
  • 2+ years of experience in semiconductor manufacturing, process development, or equivalent academic research in semiconductor technologies
Preferred Qualifications
  • Direct experience in semiconductor mask, lithography, or wafer fabrication environments (EUV, DUV, or advanced nodes)
  • Experience with actinic mask inspection, defect printability analysis, or mask repair
  • Strong background in BEOL or FEOL process control, mask process qualification, or high-volume semiconductor manufacturing
  • Experience defining tool requirements, specifications, and roadmap strategy for semiconductor material, equipment, or processes
  • Proven track record working with semiconductor equipment suppliers and engaging in early‑stage tool or process development
  • Hands‑on experience with EUV or High-NA EUV mask/wafer technology development
  • Deep understanding of lithography fundamentals, including EUV systems, mask‑to‑wafer correlation, and pattern transfer fidelity
  • Experience with lithography simulation, OPC, or mask pattern design for advanced nodes
Job Profile

Semiconductor Process Eng (Supervisory) 3

Relocation Level

TBD

Benefits
  • Medical, dental, and vision plans with options to meet family healthcare needs and budget
  • Income protection if unable to work due to illness or injury, and paid family leave
  • Robust paid time‑off program and paid holidays
Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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