DRAM Device & Cell Technology Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a DRAM Device & Cell Technology Engineer at Micron’s Boise R&D site, you will play a central role in defining, developing, and optimizing next generation DRAM architectures, cell technologies, and access device technologies. You will collaborate closely with device engineers, process integration teams, process teams, modeling groups, design teams, and product engineering partners to push the limits of density, performance, reliability, and manufacturability for future DRAM nodes.

This position is highly technical and hands on, requiring deep knowledge of device physics and semiconductor processing. Strong experimental design skills, and the ability to translate data into device, design, integration, or process innovations is required.

• DRAM Cell & Access Device Development:
  Define electrical targets for access devices, capacitors, and cell stack elements. Evaluate new cell structures, materials, and integration schemes to improve density, retention, disturb immunity, and sensing margins. Partner with modeling teams to validate device/cell behavior against TCAD and compact models.
• Silicon Characterization & Data Analysis:
  Design and implement experiments on silicon:
  Perform in‑depth electrical characterization: ION/IOFF distributions, Vt extraction, retention behavior, disturb mechanisms, leakage paths, and variation analysis. Extract insights from large data sets using statistical methods; propose actionable design or process improvements.
• Array Operation & System-Level Understanding:
  Analyze array‑level behaviors such as activation, sensing, disturb interactions, and read window margin. Work with circuit teams on WL/BL drivers, sense amplifier interactions, and operation sequence optimization.
• Cross-Functional Integration &
  
  Collaboration:
  
  Work with internal groups and manufacturing sites to ensure robustness and scalability of developed solutions. Support technology transfer from R&D to high‑volume manufacturing.
• Technology Roadmap Contribution:
  Participate in defining DRAM scaling paths (3D DRAM, new device concepts, capacitor innovations, new materials). Benchmark internal versus industry device/cell capabilities and propose strategy adjustments.

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or related field.
• Strong understanding of semiconductor device physics (MOSFETs, access devices, capacitors).
• Experience with electrical characterization, device testing, and data analysis.
• Familiarity with DRAM operation fundamentals (activation, sensing, disturb mechanisms).
• Proficiency with scripting and data analysis tools (Python, MATLAB, JMP, etc.).

• Ability to communicate experimental results clearly and drive cross‑team alignment.
• Hands‑on experience with DRAM or NAND device development.
• TCAD simulation experience (Synopsys Sentaurus, Silvaco).
• Experience with semiconductor device fabrication or advanced BEOL integration.
• Knowledge of reliability mechanisms and device variation analysis.

Micron offers a comprehensive benefits package that includes medical, dental, and vision plans, income protection, paid family leave, a robust paid time‑off program, and paid holidays. For additional information, refer to Micron’s Benefits Guide.

Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.