Frontend Product Integration Engineering; cPIE Transformative HVB; -value-bits

Req

Frontend Central Product Integration Engineering (cPIE) Transformative HVB Engineer/Senior Engineer

• Process & Design Improvement:
  Initiate data‑driven solutions to identify test, design, and integration opportunities, specifically targeting high‑value‑bits and yield optimization.
• Performance Modeling:
  Develop models to benchmark tool performance and implement equipment prognostics for process integration optimization.
• Strategic
  
  Collaboration:
  
  Partner with Process, Equipment, Manufacturing, and Data Science teams to prototype initiatives and demonstrate clear business value.
• Global Solution Delivery:
  Collaborate with Global Quality, Product Engineering, and external suppliers to deploy "Best Known Method" (BKM) solutions to production.
• Cross‑Functional Implementation:
  Lead multi‑functional teams to ensure seamless communication and successful project execution across global sites.
• System Optimization:
  Facilitate the redefinition of current methods and systems to achieve "Best in Industry" status through continuous innovation.
• Global Business Support:
  Manage priorities and system enhancements to improve global business processes, maintaining a high level of detail and independence.
• Agile Mindset & Availability:
  Demonstrate a strong growth mindset with the flexibility to support engineering teams during non‑standard hours as needed.

• Education:
  
  Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Physics, or a related technical field.
• Experience:
  
  2+ years of experience in the semiconductor industry, specifically within Product Integration Engineering (PIE), Test Solutions, Product Engineering, or Circuit Design.
• Data Analysis: 2+ years of experience performing data analysis and numerical experiments using tools such as Y3, JMP, or Python.
• Technical Knowledge:
  In‑depth understanding of semiconductor manufacturing processes, equipment, and control systems.
• Problem Solving:
  Proven ability to multitask, perform root‑cause analysis, and make data‑driven decisions in a fast‑paced environment.

• Integration:
  Strong understanding of Front‑End (FE) or Back‑End (BE) process and product integration.
• Advanced Analytics:
  Proficiency in Statistical Modeling, Machine Learning (ML), or AI‑driven yield analysis.
• Domain Expertise:
  Experience with DRAM, HBM (High Bandwidth Memory), or advanced packaging technologies.
• Critical Thinking:
  Demonstrated ability to identify process gaps and implement innovative yield improvement solutions.

FAB Engineer 3 - FAB Engineer 4

Relocation Level: TBD

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.