Product Engineer; Adv Pkg Pathfinding), Heterogeneous Integration Group; HIG), Bandwi

Staff Product Engineer (Adv Pkg Pathfinding)

Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM)

• Collaborate with Advanced Package Technology team to enable sophisticated interconnect technology solutions that include wafer to wafer bonding, working with Test Solutions team to enable test solutions, providing analysis of yield and electrical characteristics data.
• Work with engineering teams on electrical failure analysis and develop DFT and characteristic data for sophisticated packaging solutions.
• Work on EFA of advanced packaging failure, extract and provide electrical and mechanical characteristics data.
• Actively mentor and develop team members to cultivate growth and development within the team and the organization.
• Work closely with various multi-functional teams, including Advanced Packaging, Design, Test Solution teams, Yield Engineering to ensure multidisciplinary development and successful enablement.
• Develop project management skills within the team to ensure efficient execution of projects, leading to timely delivery of technological solutions.
• Make final decisions on risk analysis and project prioritization, directly impacting the direction of technological development.

• Bachelors/Masters/Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field.
• At least 10 years of experience in the semiconductor industry.
• Deep knowledge of sophisticated package process/integration and DRAM or other memory.
• Excellent data extraction, analysis and reporting skills (JMP or other tools).
• Work on site in US with international travel to Singapore, Taiwan.

• Familiar with memory's testing methodology.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
• Strong record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Work on site in US with international travel to Singapore, Taiwan.

Product Development Engineer 4

Relocation Level: TBD

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.