Front End Product Integration Engineer – Test & Product Yield Integration; Senior​/Sta

Central Product Integration Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. As a Central Product Integration Engineer, you will provide technical leadership across Micron’s global network to drive yield, product quality, and successful New Product Introduction (NPI).

• Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
• Integrate and drive execution of cross‑site project data (design, test, yield, manufacturing) to closure.
• Deliver yield improvements through end‑to‑end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
• Define and execute strategies to ensure Packaging Technology and Chip‑Package Interaction readiness ahead of product qualification.
• Lead cross‑functional, global task forces to resolve yield and quality issues efficiently.
• Develop, standardize, and deploy best‑known methods (BKMs) and business processes to improve productivity.
• Communicate status, risks, and technical proposals clearly and partner with leadership to drive results.
• Travel to Micron fab and development sites as needed to support execution and alignment.

• Bachelor’s, Master’s, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
• 2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.
• Ability to work independently in a cross‑functional, global environment, manage multiple priorities, and travel 20–50%.

• Experience with DRAM High Bandwidth Memory (HBM) products.
• Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout topics.
• Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
• Demonstrated ability to drive alignment and execution in central or network‑level roles.
• Strong interest in innovation, continuous improvement, and scalable solution development.

Micron offers comprehensive benefits to support personal wellbeing and professional growth, including medical, dental, and vision plans across all locations, income protection for illness or injury, paid family leave, a robust paid time‑off program, paid holidays, and opportunity to select plans that best meet individual healthcare needs.

Micron is a proud equal‑opportunity employer and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.