Senior Member of Technical Staff; Advanced Packaging Pathfinding

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

This role is responsible for driving pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures as a senior individual contributor. The position focuses on disruptive innovation, deep technical problem-solving, and concept-to-feasibility execution, shaping future integration solutions and enabling new value creation opportunities.

The SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy.

• Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.
• Lead hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
• Develop and validate new integration approaches (e.g., mixed interconnect architectures, advanced bumping strategies, next-gen substrates).
• Perform deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.
• Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.

• Own key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.
• Design and execute experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.
• Develop scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.
• Translate innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.
• Document and communicate findings to influence technology roadmap decisions and downstream development programs.

• Engage with internal and external stakeholders to translate customer requirements and system trends (AI, HPC, memory integration, chiplets) into actionable technical problems.
• Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.
• Contribute to value proposition development by linking technical innovation to performance, cost, and scalability benefits.

• Work closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.
• Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.
• Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.

• Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.
• Influence cross-functional teams (process, product, integration) to align on technology direction and development priorities.
• Develop executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.
• Mentor junior engineers and contribute to building technical depth and innovation culture within the team.

• Deep Technical Expert:
  Recognized for strong domain expertise in advanced packaging and integration.
• Innovation Driver:
  Generates and executes breakthrough ideas with measurable technical impact.
• Influencer:
  Drives alignment and decisions across teams without formal authority.
• Problem Solver:
  Thrives in ambiguity, breaking down complex challenges into actionable solutions.
• Collaborator:
  Effectively works across organizational and ecosystem boundaries.

• 10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.
• Demonstrated experience in technology development, pathfinding, or exploratory R&D.
• Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).
• Proven ability to solve complex technical problems and translate concepts into experimental validation.
• Strong communication skills to articulate technical insights and business relevance.

• Advanced degree (MS/PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field.
• Experience in heterogeneous integration, chiplet architectures, or next-generation interconnect technologies.
• Track record of innovation (patents, publications, or first-of-a-kind solutions).
• Familiarity with design–process co-optimization and system-level trade-offs.

• Enable next-generation advanced packaging innovations through hands-on technical leadership.
• Influence Applied Materials' long-term packaging technology roadmap.
• Deliver differentiated technical…