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Staff Engineer - Dry Etch R&D AI Packaging

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Memory Malaysia Sdn Bhd
Full Time position
Listed on 2026-07-24
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer
Salary/Wage Range or Industry Benchmark: 110000 - 160000 USD Yearly USD 110000.00 160000.00 YEAR
Job Description & How to Apply Below
Position: Staff Engineer - Dry Etch R&D for AI Packaging

Micron Technology in Boise, Idaho seeks a Senior/Staff Engineer for the Dry Etch R&D team. You will develop and optimize plasma-based etch processes for next-generation packaging, collaborating across process, integration, and manufacturing to drive performance and yield.

You will apply structured experimentation, first-principles reasoning, and data analytics to complex process challenges, with opportunities to influence technology roadmaps and enable high-volume production.

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