Sr Product Development Engineer
Listed on 2026-07-25
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Engineering
Process Engineer, Quality Engineering, Manufacturing Engineer, Mechanical Engineer
Position Overview
Responsible for CPI related issues for Micron’s DRAM memory products from pathfinding through NPI start up into HVM. Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products, coordinate DRAM device/package/module end-to-end reviews. Fundamental understanding of key risks in Fab BEOL, Fab memory array design/processes, wafer probe flows, wafer/device bumping & flip chip assembly technologies, package design, assembly processes, and materials & process interaction effects.
Position RequirementsEmployer will accept a Master’s degree in Material Science Engineering, Chemical Engineering, Metallurgical Engineering, Electrical Engineering, Physics or related field and 60 months of experience in the job offered or in an Engineering-related occupation.
BenefitsMicron offers medical, dental and vision plans, income protection, paid family leave, paid time‑off program, paid holidays, and other benefits. For additional information regarding the benefit programs available, please see the Benefits Guide posted on
Equal Employment Opportunity StatementMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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