Staff Engineer, APTD Photolithography

Process Engineer Focused On Advanced Packaging Photolithography

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging organization at Micron is building the foundation for the AI era. We work at the intersection of materials, processes, and manufacturing to enable next-generation memory and packaging technologies. Our teams collaborate closely across R&D, manufacturing, and suppliers to turn innovation into scalable, high-quality solutions—and we enjoy solving hard problems together!

As a Process Engineer focused on Advanced Packaging Photolithography, you will play a critical role in developing and optimizing lithography processes that directly impact product quality, yield, and reliability. This role offers hands-on technical ownership, strong cross-functional collaboration, and the opportunity to influence how advanced packaging technologies move from development into high-volume manufacturing.

Responsibilities:

• Develop and optimize photolithography processes for advanced packaging applications, including thick and ultra-thick photoresist patterning
• Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem-solving and statistical methods
• Identify, diagnose, and resolve lithography-related process issues using failure analysis, FMEA, SPC, and related methodologies
• Lead process, equipment, and material evaluations and support qualification and baseline changes
• Collaborate with cross-functional teams and suppliers to enable robust integration and smooth technology transfer to manufacturing

Minimum Qualifications:

• Master's or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical field
• 3+ years of experience in semiconductor photolithography or related process engineering
• Strong foundation in lithography fundamentals, including resist processing, alignment, overlay, and CD control
• Experience applying DOE, SPC, and data-driven analysis to process optimization
• Ability to manage multiple priorities and resolve manufacturing line issues independently and collaboratively

Preferred Qualifications:

• Experience with advanced packaging or backend semiconductor technologies
• Hands-on experience with lithography tools, track systems, and lithography-related metrology
• Experience developing processes for high-aspect-ratio or large topography features
• Familiarity with wafer thinning, plasma dicing, bonding, or packaging-specific patterning challenges
• Experience leading or influencing cross-functional technology development initiatives

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.