Senior Package Architect – Advanced Packaging & Systems
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-08-06
Listing for:
Micron Technology, Inc
Full Time
position Listed on 2026-08-06
Job specializations:
-
Engineering
-
Design & Architecture
Job Description & How to Apply Below
Micron Technology, Inc is seeking a Package Architect for advanced packaging and system exploration in Boise, Idaho. The role involves defining advanced package architectures and conducting trade-off studies for future memory systems. The ideal candidate should have a bachelor's degree in a relevant field and over 10 years of hands-on package design or simulation experience.
The offered salary range is between $177,000 and $387,000 annually, in addition to potential benefits and bonuses, reinforcing Micron's commitment to diversity and inclusion in the workplace.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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