RegE Process Integration Engineer

Req  RegE Process Integration Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are passionate about advancing semiconductor manufacturing through innovation, collaboration, and continuous improvement. Our Process Integration team plays a critical role in enabling leading-edge DRAM technologies by optimizing processes, improving yield, and driving manufacturing excellence. We foster a culture of technical curiosity, data-driven decision making, and cross-functional partnership.

As a Fab RegE Process Integration Engineer (Bevel/Backside Focus), you will lead the development, optimization, and sustainment of RegE, bevel, and backside processes that directly impact product quality, yield, and reliability. This role offers the opportunity to solve complex manufacturing challenges, influence future technology nodes, and work closely with Process, Equipment, RDA, and Manufacturing teams to deliver innovative process solutions.

• Develop and optimize RegE, bevel, and backside process technologies to improve yield, quality, reliability, and cost performance
• Lead process improvement initiatives, utilizing data-driven methodologies to identify, diagnose, and resolve manufacturing challenges
• Monitor and improve process health metrics, defect control strategies, and process capability to strengthen manufacturing robustness
• Partner with cross-functional teams to investigate process abnormalities, implement corrective actions, and mitigate manufacturing risks
• Support technology development, qualification, and transfer activities by deploying best-known methods and capturing technical learning

• Bachelor's degree in Engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related technical field
• Minimum 3 years of semiconductor fab or high-volume manufacturing experience, including at least 3 years working with memory technologies with DRAM preferred
• Minimum 2 years of experience driving yield improvement, cost reduction, and quality enhancement initiatives in semiconductor manufacturing
• Experience with RegE, bevel, and backside processes
• Understanding of transistor operation, scaling challenges, and device reliability fundamentals

• Master's or PhD in Materials Science, Electrical Engineering, Electronics Engineering, Chemical Engineering, or a related field
• Experience in process integration, technology development, yield analysis, device engineering, TD, or quality and reliability activities
• Experience in a 300mm semiconductor manufacturing environment
• Knowledge of technology transfer, process transfer, module ownership, ramp-up activities, and trend sustainment
• Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives

• Semiconductor Process Engineer 3 - Semiconductor Process Engineer 4

Relocation Level: TBD

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