Director, Technical Development

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The DRAM Packaging organization is responsible for developing and delivering advanced memory packaging solutions that enable Micron’s next generation products. The team partners across design, technology development, manufacturing, quality, supply chain, and external ecosystem partners to drive innovation, accelerate product development, and deliver industry‑leading packaging technologies that support markets including AI, cloud, mobile, automotive, high‑performance computing, and data centers!

As the Director of DRAM Packaging, you will lead the strategy, development, and execution of advanced packaging solutions across Micron's memory portfolio. You will define technology roadmaps, drive innovation in next‑generation packaging architectures, and build a high‑performing global engineering organization. This executive leadership role combines technical expertise, business strategy, customer engagement, and digital transformation to accelerate innovation, improve organizational effectiveness, and strengthen Micron’s competitive position.

• Define and execute long‑term DRAM packaging strategies that support future product, technology, and business objectives
• Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next‑generation interconnect solutions
• Drive adoption of AI, machine learning, advanced analytics, and digital engineering approaches to improve product development, manufacturing, and engineering productivity
• Build, develop, and lead a global packaging organization focused on innovation, technical excellence, accountability, and operational execution
• Partner with design, product engineering, manufacturing, quality, supply chain, and technology development teams to deliver successful products from concept through high‑volume manufacturing
• Establish and maintain strategic relationships with customers, OSAT partners, foundries, suppliers, equipment vendors, and research institutions
• Lead technology investment decisions through driven benchmarking, cost analysis, risk assessment, and case development
• Drive organizational performance through scalable engineering processes, automation, knowledge management, and data‑driven decision making

• Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field
• 15+ years of semiconductor packaging experience, including delivery of advanced packaging technologies from development through high‑volume manufacturing
• 10+ years of experience leading engineering teams, complex technology programs, or global engineering organizations
• Demonstrated expertise in advanced packaging technologies, including HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration, or related platforms
• Proven experience driving business‑critical technology decisions through technical analysis, risk assessment, and multi‑functional collaboration

• Master’s degree or PhD in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field
• Experience implementing AI, machine learning, advanced analytics, or digital engineering solutions to improve engineering, manufacturing, or business outcomes
• Experience leading digital transformation initiatives involving automation, data science, and engineering productivity improvements
• Strong executive…