DRAM Process Integration Engineer — Shape -Gen Memory
Listed on 2026-10-07
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Engineering
Process Engineer, Electronics Engineer, Materials Engineering
Micron Technology, Inc. in Boise, Idaho, is seeking a DRAM Process Integration Engineer to drive advanced memory device integration from concept to silicon.
You will lead cross-functional teams in process development, device physics analysis, and DOE-driven experiments to optimize performance, yield, and cost. The ideal candidate holds an MS or PhD in a relevant field, has strong knowledge of semiconductor device physics and materials science, and demonstrates a track record of delivering
Our team is growing, and we are hiring a DRAM Process Integration Engineer — Shape Next-Gen Memory in Boise, , United States.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the DRAM Process Integration Engineer — Shape Next-Gen Memory role at Micron Technology, Inc., based in Boise, , United States.
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