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Wafer Bonding Process Development Intern — AI-Driven R&D

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology
Apprenticeship/Internship position
Listed on 2026-08-18
Job specializations:
  • Research/Development
    Research Scientist
Salary/Wage Range or Industry Benchmark: 28000 - 41000 USD Yearly USD 28000.00 41000.00 YEAR
Job Description & How to Apply Below

Micron Technology in Boise, Idaho is offering a Wafer Bonding Process Development Intern role within the Technology Development (R&D) organization. You will design and execute experiments, evaluate process solutions, and analyze data to improve yield, quality, and manufacturability in next-generation semiconductor devices.

You will work with AI-enabled tools, collaborate with engineers, and communicate findings through technical reports and presentations while pursuing an MS or PhD in a related

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