More jobs:
Wafer Bonding Process R&D Intern - Build Next-Gen Semiconductors
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-08-18
Listing for:
Micron Technology, Inc
Apprenticeship/Internship
position Listed on 2026-08-18
Job specializations:
-
Research/Development
Research Scientist
Job Description & How to Apply Below
Micron Technology, Inc. in Boise, Idaho invites a Wafer Bonding Process Development Intern to contribute to cutting-edge semiconductor research. You will work with engineers to design experiments, analyze results, and implement improvements in wafer bonding processes.
The role emphasizes AI-enabled workflows, data visualization, and collaboration across disciplines in a fast-paced R&D setting. This internship offers hands-on experience with state-of-the-art technology and practical training.
#J-18808-LjbffrTo View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×