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Wafer Bonding Process Development Intern — AI-Driven R&D
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-08-27
Listing for:
Micron
Apprenticeship/Internship
position Listed on 2026-08-27
Job specializations:
-
Research/Development
Research Scientist
Job Description & How to Apply Below
Micron Technology, based in Boise, Idaho, is seeking a Wafer Bonding Process Development Intern to join the R&D team. You will design and run experiments, analyze data, and help optimize wafer bonding for next‑generation semiconductor devices.
You will collaborate with experienced engineers, apply AI tools to speed up learning, improve yield and manufacturability, and communicate findings through technical reports and presentations.
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