Photonics Packaging Engineer

Industry: Quantum and Photonics Technologies

Our client is a leader in the development of next‑generation photonic and quantum‑enabled systems. They focus on creating solutions where performance, stability, and scalability are critical, particularly through world‑class photonics packaging.

As a Photonics Packaging Engineer
, you will be responsible for leading the design, development, and industrialization of photonic packaging solutions for high‑performance optical and optoelectronic systems. This hands‑on, industry‑driven role will focus on ensuring reliability, repeatability, and manufacturability, acting as the bridge between R&D and production.

• Design and develop photonic and optoelectronic packaging solutions (fiber attach, free‑space optics, integrated photonic circuits, hermetic and non‑hermetic assemblies)
• Oversee optical alignment, bonding, and attachment processes (active/passive alignment, adhesives, soldering, laser welding, etc.)
• Develop packaging architectures optimized for performance, thermal stability, reliability, and scalability
• Lead Design for Manufacturability (DFM) and Design for Assembly (DFA) efforts to transition packages from prototype to production
• Specify and qualify materials, processes, and suppliers for photonic packaging
• Perform failure analysis, reliability testing, and environmental qualification (thermal cycling, vibration, shock)
• Work cross‑functionally with photonics design, electronics, mechanical, and systems teams to ensure integration

• Degree in Photonics, Optical Engineering, Physics, Electrical Engineering, or a related field
• 3+ years of industry experience in photonics packaging or optoelectronic manufacturing
• Proven experience with fiber attachment and alignment in an industrial environment
• Direct experience packaging photonic integrated circuits (PICs)
• Experience developing or working with automated photonics assembly systems

Competitive salary package, including benefits and equity.