Senior Director, Technical Business Development - DIC & Advanced Packaging

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effective. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Siemens Digital Industries Software seeks a proven and motivated individual to lead the Technology Solutions Sales organization for 3

DIC and Advanced Packaging. 3

DIC is one of the most strategically important and fast-moving areas in the semiconductor industry. Siemens has established early customer relationships and pilots, and what’s needed now is a leader who can convert that early momentum into a repeatable, scalable new business engine — while building the internal alignment and best practices to sustain it.

This role is as much about internal leadership as external selling. You will partner closely with regional Sales, Technical Sales, and Portfolio Unit teams to surface opportunities, align on go-to-market strategies, and drive 3

DIC growth.

• Own and lead the strategy to identify, develop, and close net-new 3
  
  DIC and advanced packaging business opportunities in partnership with regional Sales and Technical Sales leaders
• Build repeatable approaches to opportunity development and closure — creating best practices for the broader team
• Act as the primary connector across Sales, Technical Sales, and Portfolio Unit teams — building the alignment needed to move opportunities forward
• Partner with Portfolio Unit and R&D teams to ensure field insights feed into product strategy and the field has what it needs to win
• Support new business development for our Electronic Board Systems (EBS) business unit
• Lead and develop a high-performing team of Account Technology Managers (ATMs), coaching on territory planning and new business growth
• Define and manage sales territories annually, contributing to multi-year global growth plans for 3
  
  DIC
• Partner with marketing to design and execute campaigns, seminars, and webinars that generate new 3
  
  DIC leads and build market awareness

• Bachelor's degree in Electrical Engineering or Computer Science and 12+ years' experience in EDA, semiconductor design, or electronics industries
• Deep knowledge of 3
  
  DIC and advanced packaging strongly preferred
• Familiarity with Electronic Board Systems and the broader EDA landscape an advantage
• Proven ability to build collaborative momentum across Sales, Technical Sales, and Portfolio teams in a matrixed environment
• Track record of creating structure and best practices in ambiguous, fast-moving environments while delivering near-term results
• Demonstrated success leading technical sales teams and converting emerging market opportunities into new business
• Strong prospecting, demand creation, and negotiation skills
• Executive-level communication and influencing skills, internally and externally
• Comfortable operating with ambiguity and driving progress when the playbook is still being defined

• 30%+ travel required
• Preferred location:
  North America, near a major airport

We’re dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need.

Salary: $274,700 $%