Sr. Advanced Semiconductor Packaging Engineer

We are seeking a Sr. Advanced Semiconductor Packaging Engineer in our Brooklyn Park, MN, Location.

We are looking for an experienced semiconductor packaging engineer to develop innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers. The ideal candidate will be a mid-career engineer with a background in advanced packaging concepts. This role will work alongside ASIC designers, ion trap designers and fabricators, optical designers, and third-party vendors to prototype, design, and fabricate ion trap assemblies for our quantum computers.

Candidates should expect to be immersed in a fast-paced, multi-functional, team-based, challenging technical environment where an individual with talent and initiative can stand out and thrive.

All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.

• Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps
• Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density
• Work with vendors to implement and validate packaging processes
• Support all stages of ion trap development to ensure compatibility with packaging
• Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
• Engage with 3rd parties to cultivate possible key partnerships, supplier relationships, and co-development opportunities

• Bachelor’s degree minimum
• 5+ years of experience in an engineering or R&D environment
• 3+ years of experience in advanced semiconductor packaging development
• Due to Contractual requirements, must be a U.S. Person defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status.
• Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

• PhD in Physics or Engineering
• 7 years of experience with advanced large-area multi-chip semiconductor packaging technologies
• 5 years of experience with large heterogeneous integration and 2.5-3D packaging techniques
• 5 years of experience with high-density I/O technologies
• Experience with photonic packaging and fiber-to-chip coupling is a plus
• A proven track record of innovation and IP development
• Experience working within a cross-functional team environment

$115,000 - $135,000 a year

The pay range for this role is $115,000 – $135,000 annually. Actual compensation within this range may vary based on the candidate’s skills, educational background, professional experience, and unique qualifications for the role.

Quantinuum is a leading quantum computing company delivering a full stack platform designed to make quantum computing deployable in real-world environments. With active engagements spanning pharmaceuticals, material science, financial services, government, industrial sectors, and leading academic and research institutions worldwide, we are helping organizations unlock the transformative potential of quantum computing.

Our global team of more than 800 employees includes many of the world's leading scientists, engineers, and researchers, with more than 70% of our technology team holding advanced degrees at the Master's or PhD level. Headquartered in Broomfield, Colorado, Quantinuum operates across the United States, United Kingdom, Germany, Japan, and Singapore.

By joining Quantinuum, you’ll help shape the future of quantum computing, pushing the limits of technology, and making the impossible possible.

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