Substrate IC Design Engineer

IC Package Substrate Design for high-performance multi-layer interposers

My client is changing the landscape of semiconductor manufacturing! Their technology completely transcends traditional packaging methods.

This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies

This role includes shaping next-generation packaging architectures, including high-performance chip-to-chip integration solutions. Empowering in-house design of advanced substrate IC packages.

• Multiple years of experience in substrate IC package design
• Must have strong experience in advanced packaging architectures.
• Experience with hybrid bonding highly regarded.
• Advanced proficiency in Allegro Package Designer (constraint management, routing)
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
• Strong understanding of SI/PI principles and their application to package-level design
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches