Director of Sales Engineering, Data Centers

About the Role

Director of Sales Engineering – responsible for the strategic direction and performance of the Stack Forging Thermal Solutions technical sales team, driving adoption of proprietary liquid‑cooling technologies across the global Data Center Segment.

Location:

Remote or on‑site at Burlington, MA office.

• Recruit, coach, and mentor a high‑performing team of Technical Sales Executives.
• Drive a culture of accountability, technical excellence, and persistence.
• Help refine and execute the go‑to‑market strategy for the Data Center segment, targeting high‑density liquid‑cooled infrastructure.
• Oversee pipeline management and forecasting accuracy; ensure effective use of sales tools.
• Act as senior point of contact for key accounts, supporting complex Master Supplier Agreements and large‑scale negotiations.
• Maintain awareness of chip TDP trends and competitor roadmaps.
• Bridge the gap between Sales, Solutions Delivery, and Product Development to inform the DLC innovation roadmap.
• Join deep technical sessions with customer architects to demonstrate Stack Forging Thermal Solutions’ performance advantages.
• Navigate the ecosystem of Hyperscalers, OEMs, and Chip Makers to ensure early design‑cycle specification of solutions.
• Champion environmental benefits of DLC to help customers meet ESG goals.
• Ensure the team captures technical and performance requirements and communicates them to Solutions Delivery.

• Bachelor’s, Master’s, or PhD in Business, Mechanical Engineering, Thermal Engineering, or a related technical field.
• 3+ years of experience leading technical sales with a track record of meeting or exceeding revenue targets.
• Minimum 7+ years of experience bringing new technology to market in the manufacturing space.
• Experience in the Data Center segment required.
• Ability to translate complex technical concepts into compelling business cases for C‑suite executives.

• Existing senior‑level relationships within major Server OEMs (e.g., Dell, HP, Lenovo, Supermicro), Chip Manufacturers (e.g., NVIDIA, Intel, AMD) or Hyperscalers (e.g., Microsoft, Google, AWS).
• Experience in Applications Engineering or Sales Engineering roles.
• Prior experience with Direct Liquid Cooling (DLC) or high‑density rack infrastructure.
• Understanding of heat transfer, HVAC, or data center thermal management.

Hiring salary range: $112,000 – $187,000, plus a competitive bonus plan that reflects individual, group, and corporate performance. The position includes a comprehensive benefits package.

Johnson Controls International plc. is an equal employment opportunity and affirmative action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, protected veteran status, genetic information, sexual orientation, gender identity, status as a qualified individual with a disability or any other characteristic protected by law. To view more information about your equal opportunity and non‑discrimination rights as a candidate, visit EEO is the Law.

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