Auto​/Manual Wirebonder

Position: Auto/Manual Wirebonder I (23362)
Location: Chatsworth

Summary:

Operation of automatic and/or manual wire bond equipment in a clean-room environment, to manufacture high-reliability microelectronic devices.

Essential Duties and Responsibilities:

* Read and interpret assembly instructions, drawings and work instruction processes.

* Set up and run automatic and manual wire bond equipment

* Ability to handle computers in order to fine tune machine programs.

* Written tests for ESD + wirebond and ribbon bond requirements.

* Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales.

* Knowledge of periodic machines certification for bond strengths.

* Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a microelectronic device, in conformance with work instructions, drawings and specifications.

* Inspect - to the drawings/specs and procedures - the devices for defects before starting the assembly and after finishing his/her part of the assembly.

* Adhere to all ESD and other handling requirements.

* Comply with all in-house training as identified in job specific family and or specific training plan.

* Follow company 6S and continuous improvement (kaizen) objectives.

* Perform all other duties, as assigned.