Optoelectronic Component Design Engineer

Optoelectronic Component Design Engineer

Opto Diode based in Camarillo, California, has a long history of delivering industry-leading Silicon, PbS and PbSe Detectors and MIR Emitters.

Available in standard and custom designs, Opto Diode products have supported the photonics industry for over 40 years and earned a reputation for high performance, superior quality and reliability. Opto Diode was acquired by Illinois Tool Works (ITW) in 2008 and is part of the Test, Measurement, and Electronics segment within the Electrostatics division.

The Optoelectronic Component Design Engineer's responsibilities include design of photodetectors and assemblies, LED assemblies, and production testing support. The role is both customer facing and supports production. Success in this role requires strong technical depth, cross functional collaboration, project management, and the ability to manage complex and multiple engineering projects at the same time in a dynamic environment.

• Leads and supports cross-functional engineering projects from concept through production, partnering with key stakeholders to define scope, schedule, budget, and manage associated risks.
• Develop, recommend, and maintain project plans, milestones, and resource allocations.
• Drive design review processes and track progress against project timelines.
• Partner with sales to support customer communications, including design proposals and issue resolution.
• Mentor engineers and support continuous improvement initiatives.
• Manage and support the fabrication, assembly of prototype jobs.
• Help production assembly and testing with issues.

• Design and develop custom semiconductor devices, including LED's, photodiodes, IR detectors, and optical sub-assemblies.
• Create engineering documentation, including material and assembly drawings, test plans, and datasheets.
• Develops test fixtures and performs prototype testing and measurement validation activities.
• Use of AutoCAD to create concept, datasheet, material, component, mask, and assembly drawings.
• Create assembly instruction travelers, and assembly and test procedures.
• Collaborate with procurement and quality teams on material specifications.
• Strong knowledge of analog electronics
• Basic understanding of semiconductor physics wafer fabrication processes

• Provide technical leadership for back-end assembly operations including die attach, wire bonding, soldering, and testing.
• Qualify new assembly processes and materials.

Position Qualification Requirements

Required:

• Bachelor's degree in electrical engineering, Applied Physics, or related field required.
• 6+ years of experience in optoelectronic components manufacturing or engineering.
• Experience working and leading through ambiguity and organizational change.
• Experience with microelectronic packaging and assembly processes.
• Experience leading New Product Introduction (NPI) from concept through production.
• Experience working with marketing and sales teams.
• Customer Facing Technical Experience-Ability to translate customer requirements into technical specifications and product designs.
• Preferred experience with statistical
• Experience with product qualification and compliance requirements-required
• In compliance with the International Traffic in Arms Regulations (ITAR), must be a U.S. Person.
• Candidates must be able to work with export-controlled information and comply with all applicable U.S. export regulations.
• Experience with product qualification and compliance requirements.

Preferred:

• Master's degree in electrical engineering, Applied Physics, or related field required.
• Knowledge of Wafer Fabrication Processes
• Experience leading New Product Introduction (NPI) from concept through production.
• Tools and methodologies (SPC, DOE, JMP, Minitab)
• Familiarity with relevant semiconductor or photonics standards (JEDEC, MIL-STD, etc.).

Other Requirements and Conditions

• Physical/Visual Activities or Demands:
  Physical/visual activities or demands that are commonly associated with the performance of the functions of this job.
• While performing the duties of this job, the employee is frequently required to talk, hear, sit, reach outward, twist/turn, handle/manipulate objects, stand, grasp, bend, squat, crawl, climb, and type.
• The employee must carry up to 10 pounds frequently and up 25 pounds occasionally and push and pull up to 25 pounds occasionally and up to 10 pounds frequently.

Working Conditions:

Working conditions commonly associated with the performance of the functions of this job.

Machines, Tools, Equipment and Work Aids that may be representative but not all inclusive of those commonly associated with this position:

Computer, Microsoft Office Suite, calculator, telephone, fax, scanner, printer, hand tools, gauges, small power equipment, test meters (multimeter, picoamp meters, power supplies, various assembly fixtures, optical microscopes, spectrometers, wire bonders, die attach systems, environmental chambers, optical…