Program Engineer- Fabrication
Listed on 2026-06-26
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Engineering
Electronics Engineer, Materials Engineering
Program Engineer, Fabrication
MIT.nano , to support the Technical Concierge Service of the Northeast Microelectronics Coalition (NEMC) Hub. This role combines expert-level technical matchmaking, cross-facility coordination, hands‑on microfabrication and characterization work, and helps translate early‑stage concepts into manufacturable processes by connecting users with the most appropriate facilities, expertise, and resources across the regional microelectronics ecosystem. It serves as a key interface between academic researchers, industry partners, government organizations, and startups, ensuring efficient Lab‑to‑Fab translation and strengthening the regional microelectronics ecosystem to enable rapid access to infrastructure and expertise required to move ideas from concept to manufacturing.
ResponsibilitiesAct as a liaison between diverse stakeholders to facilitate Lab‑to‑Fab translation, coordinate cross‑facility collaborations, and perform hands‑on microfabrication and device characterization.
Required Qualifications- Bachelor's degree in electrical engineering, materials science, applied physics, microelectronics, or a related field.
- Minimum of seven years of related experience in a research environment, including graduate student experience.
- Hands‑on experience with two or more microfabrication processes (e.g., lithography, etching, deposition, packaging, or device processing & testing).
- Experience with materials or standard device metrology techniques relevant to microelectronics.
- Strong ability to evaluate technical problems and propose practical experimental or fabrication pathways.
- Excellent communication skills and ability to work with multidisciplinary teams across academia and industry.
- PhD in a related field.
- Experience working in shared research facilities or user laboratories.
- Experience developing SOPs or training materials.
- Familiarity with semiconductor device fabrication, heterogeneous integration, or advanced packaging.
- Knowledge of regional and national microelectronics infrastructure networks.
This is a one‑year appointment with potential for extension based on funding.
6/5/2026
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