Program Engineer- Fabrication
Listed on 2026-08-05
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Engineering
Electronics Engineer, Materials Engineering, Systems Engineer, Electrical Engineering
Program Engineer
- Fabrication
PROGRAM ENGINEER, FABRICATION, MIT.nano, to support the Technical Concierge Service of the Northeast Microelectronics Coalition (NEMC) Hub. This role combines expert-level technical matchmaking, cross-facility coordination, hands-on microfabrication and characterization work; will help translate early-stage concepts into manufacturable processes by connecting users with the most appropriate facilities, expertise, and resources across the regional microelectronics ecosystem; serve as a key interface between academic researchers, industry partners, government organizations, and startups, ensuring efficient Lab-to-Fab translation and play a critical role in strengthening the regional microelectronics ecosystem, enabling researchers and innovators to rapidly access the infrastructure and expertise required to move ideas from concept to manufacturing.
A full job description can be found here: (Use the "Apply for this Job" box below).-fabrication
REQUIRED:
Bachelor's degree in electrical engineering, materials science, applied physics, microelectronics, or a related field; a minimum of seven years of related experience in a research environment (including graduate student experience); hands-on experience with two or more microfabrication processes (e.g., lithography, etching, deposition, packaging, or device processing & testing); experience with materials or standard device metrology techniques relevant to microelectronics; strong ability to evaluate technical problems and propose practical experimental or fabrication pathways;
and excellent communication skills and ability to work with multidisciplinary teams across academia and industry. PREFERRED:
PhD in a related field; experience working in shared research facilities or user laboratories; experience developing SOPs or training materials; familiarity with semiconductor device fabrication, heterogeneous integration, or advanced packaging; and knowledge of regional and national microelectronics infrastructure networks.
This is a one-year appointment with potential for extension based on funding. 6/5/2026
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