ElectroMechanical Packaging Engineer III

Electro Mechanical Packaging Engineer III | Lockheed Martin

Join us at Lockheed Martin as an Electro-Mechanical Packaging Engineer where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, an electronics and mechanical CAD (drawing development and release).

Location:

This position does not support teleworking; the selected candidate will be located near our Lockheed Martin Space facility in either:
• Englewood CO (Relocation assistance available)
• Cape Canaveral FL (
* No relocation assistance for this location) You are expected to work a flexible 9x80 schedule in the office full-time.

As an Electro-Mechanical Packaging Engineer within the Fleet Ballistic Missile (FBM) Avionics team, you will be the technical lead for all Electro-Mechanical items within the Avionics Portfolio. Tasks include:
• Sustaining the current deployed weapon system ensuring continued credibility and availability of our nation's strategic deterrent.
• Become a Certified Product Engineer delegate for key Avionics HW.
• Act as a key participant in Material Review and Failure Review Boards.
• Interface with Parts, Materials, and Process Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
• Prepare all applicable drawings and documentation needed to maintain production of Avionics hardware and facilitate production re-starts including evaluation of re-qualification requirements. Key activities you will accomplish in this role:
• Identification and resolution of obsolescence issues affecting Avionics hardware.
• Perform requalification assessments for production restarts
• Develop Memorandum of Requalification Agreements
• Support missile level investigations and troubleshooting
• Perform failure analysis of HW defects and identify root cause and corrective actions
• Support resolution of vendor requests for information or change (VRIC)

• Bachelors degree in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education.
• Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
• CAD modeling and drafting experience (CREO, Solid Works and/or similar CAD data modeling experience, model based engineering.
• Willing and able to obtain and maintain a DoD Secret clearance, thus US Citizenship is required.

• Working knowledge EPDM tools or equivalent.
• Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
• Experience with 3D printing/prototyping.
• Missile/Aerospace related experience.
• Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
• Familiarity with FBM specifications/procedures.
• Familiarity and experience partnering with SP/SPF Customer Partners.
• Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
• Previous CPE and MRB experience.
• Ability to communicate issues and additional resource needs to leadership.
• Experience with subcontracted hardware suppliers.
• Knowledge of cable manufacturing processes (connectors, crimping, soldering, forming, testing).
• Experience performing tolerance stack-ups.
• Exposure to Requalification Activities including MORAs and Supplier Relocations.
• Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
• Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.).
• Hands-on hardware experience.

By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.