Senior Process Engineer

Senior Process Engineer

This Senior Process Engineer role focuses on developing, optimizing, and scaling advanced manufacturing and packaging processes for optoelectronic and silicon photonics products. You will lead process development for flip chip assembly and thermo-compression bonding, support 2.5D and 3D packaging architectures, and play a key role in transitioning processes from development to high-volume production. This is a high-visibility position with significant ownership and impact in a rapidly growing, well-funded startup operating in a state-of-the-art cleanroom and pilot manufacturing environment.

• Develop, refine, and optimize manufacturing processes used in the assembly of optoelectronic and silicon photonics products.
• Design and implement advanced packaging processes, with a primary focus on flip chip assembly and thermo-compression bonding (TCB).
• Support the development and implementation of 2.5D and 3D packaging architectures for next-generation products.
• Work cross-functionally with optics, electronics, and process engineering teams to define experiments and execute DOE (Design of Experiments) studies aimed at improving yield, quality, and performance.
• Monitor process health, yield metrics, and failure trends to identify areas for improvement and risk mitigation.
• Perform detailed root cause analysis and process troubleshooting to resolve manufacturing issues and improve reliability.
• Create statements of work (SOWs) and project plans for new process development initiatives and continuous improvement projects.
• Collaborate closely with suppliers, subcontractors, OSATs, and contract manufacturers to align process requirements and ensure robust execution.
• Help scale manufacturing processes from development and pilot line stages into volume production, ensuring manufacturability and repeatability.
• Contribute to the buildout of pilot manufacturing lines and the implementation of advanced packaging capabilities.
• Apply statistical methods and tools to conduct yield analysis, FMEA, and statistical process control to maintain and improve process performance.
• Provide technical leadership and act as a key subject matter expert on advanced packaging within the organization.
• Support domestic and international travel, including visits to Asia, to engage with OSAT and manufacturing partners as needed (less than 20% travel).

• 5+ years of process engineering experience within semiconductor, photonics, optoelectronics, or advanced manufacturing environments.
• Strong, hands-on experience with die-level flip chip packaging, specifically beyond SMT or PCB assembly.
• Proven experience with Die-to-Wafer or Wafer-Level Packaging processes.
• Thermo-Compression Bonding (TCB) experience required, including process setup, optimization, and troubleshooting.
• Demonstrated experience developing manufacturing processes and successfully bringing them to production scale.
• Working knowledge of DOE (Design of Experiments), FMEA, yield analysis, and statistical process control methodologies.
• Experience using JMP, Minitab, or similar statistical software for data analysis and process optimization.
• Understanding of packaging reliability principles and failure analysis techniques in semiconductor or photonics manufacturing.
• Ability to work effectively in a fast-paced, highly collaborative startup environment.
• Willingness to travel domestically and internationally, including occasional travel to Asia, with less than 20% total travel.

• Background in semiconductor, optoelectronics, photonics, or advanced packaging manufacturing.
• Experience in process development and optimization for flip chip, wafer fab, and wafer-level packaging.
• Familiarity with reliability testing and qualification processes for advanced packaging technologies.
• Bachelor's degree in Engineering, Physics, Materials Science, or a related field preferred.
• Equivalent industry experience may be considered in lieu of a formal degree.
• Comfort working with cross-functional engineering teams and external manufacturing partners.
• Interest in contributing to the buildout of pilot lines and scaling advanced packaging initiatives in a startup setting.

This role is 100% onsite in Carlsbad, CA, within a startup environment of approximately 30 employees globally and about 12 employees onsite. You will work in a state-of-the-art cleanroom and pilot manufacturing environment alongside a collaborative engineering culture that values direct impact and ownership. The typical schedule runs from 8:00 AM to 5:00/5:30 PM, with less than 20% travel required, including occasional trips to Asia to support OSAT and manufacturing partners.

The organization offers excellent benefits, including comprehensive healthcare options with high employer contribution, HSA support, 401(k), stock options, and relocation assistance for exceptional candidates. The environment emphasizes advanced silicon photonics technology, strong funding, and high customer…