Sr. Packaging Engineer

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high-performance radio frequency (RF) and microwave applications.

With design, sales and manufacturing locations in over 30 countries, Mini-Circuits’ products are used in a range of wired and wireless communications applications. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.

Mini-Circuits’ sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive

The Sr. Packaging Engineer is responsible for leading the development and execution of all packaging processes supporting MMIC. This role owns MMIC packaging and process development to drive innovation and ensure optimal performance. Working closely with Quality & Reliability, CAD and other Engineering teams, as well as internal and external package assembly houses, this position guides projects from design conception through release-to market ensuring alignment with long-term goals.

- $130,000 - $165,000

• Lead the design and development of manufacturable package assembly drawings in consultation with the MMIC and design engineers to ensure manufacturing and product goals.
• Lead MMIC assembly discussions with internal and external packaging houses.
• Maintain existing package designs and create new package designs including but not limited to laminate, leadframe, overmold and air cavity construction.
• Work with factories to develop new materials systems and packaging platforms.
• Design and optimize tooling and fixturing to facilitate assembly and manufacturing.
• Continuously improve existing manufacturing techniques by researching new epoxies, attachment methods, interconnect methods, etc.
• Perform technical design reviews at various stages of the product development, and modify existing designs to improve performance, quality, manufacturability, production yields, etc.
• Perform thorough peer review of designs to help team minimize defects.
• Maintain accurate and complete documentation and archive design files for all products by working with internal documentation control systems and guidelines.
• Assist in qualification of new contract manufacturers, as well as lead collaboration to improve assembly yields and reduce manufacturing cost.
• Efficiently solve operational and material issues as they arise.
• Assist in FA activities as relates to the manufacturing process during qualification and on customer RMAs.
• Comply with documented departmental and corporate procedures and recommend changes/ improvements to procedures.

The duties, responsibilities and expectations described above are not a comprehensive list and additional tasks may be assigned to the member, within the scope of the position.

• BSME and 7+ years of industry engineering experience, with at least 3 years of semiconductor packaging and/or process development.
• MSME or equivalent preferred.

• Competent in microwave and milli-meter wave packaging, manufacturing and process development.
• Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques.
• Must have ability to use 2D and 3D CAD software (e.g. AutoCAD, Draftsight, Inventor, Solid Works, etc.).
• Business related computer skills including strong working knowledge of Microsoft Office.
• Professional and positive approach, self-motivated, strong in building relationships, team player, dynamic, creative with the ability to work on own initiative.
• Demonstrated strong oral and written communication skills.
• Strong relationship management, strategy development, project…