Mechanical Engineer II

Firefly Aerospace Avionics Mechanical Engineer

Firefly Aerospace is a space and defense technology company on a mission to reliably and repeatedly launch, land, and operate space systems from Earth to the Moon and beyond. As the partner of choice for critical space missions, Firefly is the first commercial company to launch a satellite to orbit with 24-hour notice and the first company to achieve a successful Moon landing.

Headquartered in north Austin, Texas, Firefly is looking for passionate, hardworking innovators to join our team and help fuel our successful trajectory into space.

• Design ruggedized electronics packaging and structural components for PCB assemblies used for launch vehicles and spacecraft applications
• Design electro-mechanical assemblies for thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance
• Perform thermal analyses (steady state thermal and thermal cycling) of electronics in aerospace environments
• Perform modal and vibration analyses of electronic assemblies with mechanical/structural components
• In addition to electronics packaging, candidate will be responsible for design of test fixturing and ground support hardware for launch vehicle and spacecraft electronics
• Support vibration, shock, and thermal test campaigns of products designed
• Candidate will be responsible for development of CAD designs, part drawings, assembly drawings, and technical documentation including presentations and reports
• Work with the PCB design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly

Required

• Bachelor of Science in mechanical engineering, aerospace engineering, or related field
• 3+ years of engineering experience designing electronics packaging and electro-mechanical assemblies via internships, professional industry experience, or academia
• 3+ years of 3D CAD design and drafting experience

Desired

• Hands on experience with design and integration of electronics packaging
• Proficiency with NX or similar CAD software and analysis tools such as ANSYS
• Experience with multi-layer PCBA enclosure design
• Experience with various design features and calculations for mechanical packaging of electronics including vent analyses, EMI/EMC mitigation strategies, multi-component tolerance stack-up calculations, bolt load calculations, Steinberg PCB solder joint fatigue, etc.
• Understanding of basic subsystems of a launch vehicle and how avionics integrate within the vehicle and interface with instrumentation
• Experience designing for CNC machining and sheet metal production, as well as selecting appropriate materials and finishing processes
• Experience with environmental analysis and test including thermal cycle, thermal vacuum, shock, and vibration
• Understanding and knowledge of GD&T