Senior Chemical & Materials Engineering; Onsite

Location

US-IA-CEDAR RAPIDS-108 ~ 400 Collins Rd NE ~ BLDG 108

United States of America

Onsite

U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

None/Not Required

Not Required

Raytheon Company, Managed by Collins Aerospace

Joining Collins Aerospace isn’t just about finding a job; it’s about embarking on a journey to redefine the future of aerospace technology. Collins Aerospace, an RTX company, is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Collins Aerospace has the capabilities, comprehensive portfolio, and expertise to solve customers’ toughest challenges and to meet the demands of a rapidly evolving global market.

We are seeking problem solvers, creative thinkers, and collaborative, disciplined, and self-motivated engineers to join our Microelectronics Engineering Group, a subgroup within Applied Research & Technology (ART). Within ART, we develop and build communication and avionics electronic solutions.

Our team is seeking a motivated and experienced Process Engineer for this role. The engineer in this position will lead the development and sustainment of electroplating modules and will support in-line and end-of-line data analytics across Z-Fab technology. Z-Fab is our Collins Microelectronics process, used to create wafer-scale, 3D passive, thick-metal components.

This position will support our Cedar Rapids, IA location.

• This role is responsible for developing, implementing, and sustaining all electroplating processes
• Responsible for developing and transferring processes to the operations group
• The engineer is expected to document process details and drive the continuous improvement of the process capability index (CpK) across all electroplating modules
• Responsible for the development of fabrication processes for the next generation of products
• The engineer's focus will be on Collins' Z-Fab 3D micro-scale fabrication manufacturing capability

• Typically requires a University Degree and minimum 5 years of prior relevant experience or an Advanced Degree and a minimum of 3 years' experience
• U.S. Citizen - U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract
• Must have experience with microfabrication electroplating process
• Understanding of the fundamentals of data analytics, statistics, and Design of Experiments (DOE)

• Prefer PhD in science, technology or engineering, with experience in semiconductor electroplating and data analytics
• Experience working in microelectronic fabrication environment.
• Understanding wafer characterization techniques and end-of-line (EOL) failure mechanisms
• Understanding statistical process control (SPC) and metrology
• Design and develop mechanical tooling for microelectronic devices.
• Demonstrated ability to plan and manage projects, troubleshoot problems, identify root causes, and implement creative corrective actions
• An active and transferable U.S. government issued Secret security clearance is preferred prior to start date. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Some of our competitive benefits package includes:

• Medical, dental, and vision insurance
• Three weeks of vacation for newly hired employees
• Generous 401(k) plan that includes employer matching funds and separate employer retirement contribution, including a Lifetime Income Strategy option
• Tuition reimbursement program
• Student Loan Repayment Program
• Life insurance and disability coverage
• Optional coverages you can buy: pet insurance, home and auto insurance, additional life and accident insurance,critical illness insurance, group legal,  protection
• Birth, adoption, parental leave benefits
• Ovia Health, fertility, and family planning
• Adoption Assistance
• Autism Benefit
• Employee Assistance Plan, including up to 10 free counseling sessions
• Healthy You Incentives, wellness rewards…