Engineer - Failure Analysis

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We are seeking an entry‑level Electrical Failure Analysis Engineer with a strong educational background and hands‑on experience in circuit analysis, specifically focused on silicon‑level devices. In this role, you will work closely with senior engineers to investigate, analyze, and resolve electrical failures in semiconductor devices. This is an excellent opportunity for early‑career engineers who are passionate about microelectronics, device physics, and advanced failure analysis techniques.

• Perform silicon‑level electrical failure analysis on integrated circuits (ICs) and semiconductor devices.
• Utilize advanced diagnostic tools such as curve tracers, semiconductor parameter analyzers, emission microscopes, and electron microscopes (SEM) to localize and characterize failures.
• Conduct fault isolation using techniques such as photon emission microscopy (PEM), laser scanning microscopy (LSM), and IR thermography.
• Assist in sample preparation for physical analysis, including die deprocessing, cross‑sectioning, and focused ion beam (FIB) milling.
• Interpret electrical test data and correlate with physical analysis to determine root cause of failures.
• Document findings in detailed technical reports and present results to cross‑functional teams.
• Collaborate with customer quality, design, process, and reliability engineering teams to drive corrective actions and improve product robustness.

• Bachelor's degree in Electrical Engineering, Microelectronics, Physics, Materials Science, or a related field.
• 0‑3 years of professional experience.
• Solid understanding of semiconductor device physics as well as analog and digital circuit fundamentals.
• Experience (through coursework, internships, or projects) with electrical characterization and troubleshooting of ICs or semiconductor devices.
• Familiarity with laboratory equipment such as oscilloscopes, curve tracers, and parameter analyzers.
• Strong analytical, problem‑solving, and documentation skills.
• Effective written and verbal communication skills.

• Hands‑on experience with photon emission microscopy (PEM), laser scanning microscopy (LSM), or similar fault isolation tools.
• Exposure to sample preparation techniques such as focused ion beam (FIB), mechanical polishing, or chemical etching.
• Knowledge of device layout analysis and interpretation of semiconductor device designs.
• Experience with failure analysis software tools (e.g., CAD device layouts, data acquisition systems).
• Understanding of reliability testing and common silicon failure modes (e.g., ESD, latch‑up, electromigration).

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