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Packaging Module Engineer — On-Site, Stock

Job in Chandler, Maricopa County, Arizona, 85249, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-05-30
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 188890 USD Yearly USD 133800.00 188890.00 YEAR
Job Description & How to Apply Below
Position: Packaging Module Engineer — On-Site, Stock Benefits

Intel Corporation is looking for a Packaging Module Engineer based in Chandler, Arizona. This role involves designing and developing innovative packaging solutions to ensure the secure transport of Intel products.

The ideal candidate will have a Master's degree in a relevant STEM field and experience in packaging assembly and statistical process control. The position offers competitive pay and benefits, with an annual salary range of $ to $.

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