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Mechanical Design Engineer – Semiconductor Packaging

Job in Chandler, Maricopa County, Arizona, 85249, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-05-30
Job specializations:
  • Engineering
    Mechanical Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 105650 - 149150 USD Yearly USD 105650.00 149150.00 YEAR
Job Description & How to Apply Below

Job Summary

We are seeking a proactive and detail‑oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross‑functionally and solving complex design problems with minimal supervision.

Key Responsibilities
  • Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
  • Develop and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners and overall package assemblies.
  • Design process media trays used during various stages of the assembly process.
  • Collaborate closely with architecture, process and assembly teams to ensure design intent and manufacturability.
  • Act as the single point of contact for all packaging mechanical design collateral needs.
  • Proactively identify and solve design and process issues, ensuring timely project execution.
Minimum

Skills and Qualifications
  • US Citizenship required.
  • Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
  • Bachelor’s degree in mechanical engineering or a STEM‑related field of study.
  • 1+ year’s experience with CAD tools such as Solid Works, Siemens NX, AutoCAD or similar 2D and 3D CAD software.
Preferred Skills
  • Master’s degree in mechanical engineering or a STEM‑related field of study.
  • Solid mechanical design foundation and 3D spatial awareness.
  • Excellent communication and interpersonal skills for effective cross‑functional collaboration.
  • Ability to interpret and generate technical drawings and specifications.
Job Information
  • Job Type: Experienced Hire
  • Shift: Shift 1 (United States of America)
  • Primary

    Location:

    US, Arizona, Phoenix
Compensation

Annual Salary Range: $–USD. This range reflects the minimum and maximum target compensation for the position across all US locations. Individual pay is determined by work location and additional factors, including job‑related skills, experience and relevant education or training.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation or ordinance.

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